back grinding wheel for silicon wafer thinning

back grinding wheel for silicon wafer thinning

Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide. Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Applications of back grinding wheel Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. Applicable Grinding Machine The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine. Silicon Wafer Back Grinding Wheels. Silicon wafer back grinding wheels are used for trimming of silicon wafers. Our back grinding wheels are designed used on Japan, Germany and China-made grinders. High efficiency, high precision and easy processing. Application: Semiconductor silicon. Workpiece material: Monocrystalline silicon and other

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grinding wheels for manufacturing of silicon wafers: a

Grinding wheels for manufacturing of silicon wafers: A

The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry. The stringent requirements for these grinding wheels include low damage on ground surfaces, self-dressing ability, consistent performance, long wheel lives, and low prices. Silicon wafer back grinding is generally divided into two steps: rough grinding and fine grinding. In the rough grinding stage, the diamond wheel with grit 46 # ~ 500 # , the axial feed speed is Website:https://morediamondwheel.com/products/Silicon_grinding_wheels_Silicon_Wafer_Back_Grinding_Wheels.htmlEmail: [email protected]?Diameter (mm): D1...

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warping of silicon wafers subjected to back-grinding process

Warping of silicon wafers subjected to back-grinding process

This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process. By analyzing the interactions between the wafer and the vacuum chuck, together with the machining stress distributions in damage layer of ground wafer, the study establishes a mathematical model to describe wafer warping during the thinning process using the elasticity theory. For wafers with diameters of 200 mm, it is typical to start with a wafer thickness of roughly 720 µm and grind it to a thickness of 150 µm or less. The coarse grinding typically removes approximately 90 percent of the excess material. A typical two-step backgrinding operation will use dual spindles with grinding wheels mounted on each spindle. The backgrinding process involves using a diamond-resin bonded grinding wheel to remove the silicon material from the back of a silicon wafer. Using a grinding wheel is highly effective, and faster and less expensive than chemical-mechanical processes and is used to remove the bulk of substrate material prior to final finish grind, polish or

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sic wafer grinding - engis

SiC Wafer Grinding - Engis

Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps. Semiconductor Back-Grinding The silicon wafer on which the active elements are created is a thin circular disc, typically 150mm or 200mm in diameter. During diffusion and similar processes, the wafer may become bowed, but wafers for assembly are normally stress relieved and can be regarded as flat. Back Grinding of Wafer with Outer Rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. In this paper, the simulation model of grinding marks of wafer in BGWOR was developed.

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edge grinding wheel, silicon wafer chamfering

Edge Grinding Wheel, Silicon Wafer Chamfering

The unrounded silicon wafer is mounted onto a grinding chuck and a profile rounding wheel rounds the edge of the wafer. The edge profile is rounded to match the customer specifications. Application of edge grinding wheel Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding. The process of backside grinding of silicon wafer Characteristics of silicon wafer selfrotating grinding method: 1 Ductility domain grinding can be realized When the grinding depth is less than a critical value, ductile domain grinding can be realized A large number of tests show that the critical value of brittle plastic conversion of Si material is about 006 m The feed speed is controlled at Back Grinding. Back grinding is a process that removes silicon from the back surface of a wafer. We provide grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications. SVM Wafer Back Grinding Capabilities: Diameters: 25mm – 300mm

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the study of the resin-bond diamond wheel for ic silicon

The study of the resin-bond diamond wheel for IC silicon

Resin diamond grinding wheels are applied to the back thinning grinding (back grinding) of IC silicon wafers. The wheels should have very high performance because the silicon wafers ground by them can reach nano-scale roughness, micron-scale damage layer thickness and micron-scale surface type accuracy. The depth of subsurface damage and Ra value of subsurface roughness are two important The most common and relative low cost thinning method is back grinding by means of mechanical removal of the residual silicon. The wafer is fixed on a porous vacuum chuck with the IC (integrated circuit) side down. The rotation axis of the grinding wheel is positioned off-axis to the rotation axis of the wafer (distance is the radius of the wafer). Grinding wheels for manufacturing of silicon wafers A . 2006 10 11 The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry The stringent requirements for these grinding wheels include low damage on ground surfaces self dressing ability consistent

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study into grinding force in back grinding of wafer with

Study into grinding force in back grinding of wafer with

Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck Back Grinding Wheels. Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different silicon wafer beveled semiconductor silicon grinding wafer Prior art date 1989-04-17 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Lifetime Application number US07/641,780 Inventor Nobuyoshi

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diamond backgrinding wheels - smart cut technology

Diamond Backgrinding Wheels - SMART CUT technology

NEW GENERATION & TECHNOLOGY. U sed on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from 8” to 14” O.D . Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others. Available in large variety of bond such as sintered (metal bond), resin bond, vitrified bond Sj Surfine Pvt. Ltd. - Offering Silicon Wafer Back Grinding Wheel, Grinder Wheel, Grindingwheel, ग्राइंडिंग व्हील at Rs 20000/piece in Thane, Maharashtra. Read about company. Get contact details and address| ID: 13454031455 Coarse Grind. Based on the wafer type to be ground, we offer a variety of coarse wheels to suit specific needs. The standard coarse wheel that works on most of the applications is the Norton Winter #320 wheels. These can be offered in varying hardness for grinding different wafer types. A typical specification would be COARSE#3H1BXL9002.

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a study on pore-forming agent in the resin bond diamond wheel

A Study on Pore-forming Agent in the Resin Bond Diamond Wheel

Grinding wheel type (Pore-forming agent) Average roughness of silicon wafers (Ra nm) Wear of grinding wheels(µm/slice) A# 8.580 0.26-0.32 B# 6.715 0.4-0.45 All the tested grinding wheels with added pore-forming agent can grind the silicon wafers smoothly. The surface of the ground silicon wafer is shown in Fig. 3. Fig.3. ・Achieved high efficiency and high quality processing for SiC wafer.・Achieving Mirror Surface Finish with Low Depth Damage.・Finish grinding of hard-to-cut ma... China Back Grinding Wheel Market, Back Grind Wheel Disco, Find details about China Back Grinding Wheel for Silicon Wafer, Back Grinding Wheels for Silicon Wafer from Back Grinding Wheel Market, Back Grind Wheel Disco - More Superhard Products Co., Ltd.

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