a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

The lapping-based manufacturing method currently used to manufacture silicon wafers will not be able to meet the ever-increasing demand cost-effectively. This paper reports an experimental investigation into a grinding-based manufacturing method, which has potential to manufacture flat silicon wafers at a lower cost.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method, as shown in Fig. 1, has been investigated experimentally to demonstrate its potential to manufacture flat silicon wafers at a lower cost .

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

The lapping-based manufacturing method currently used to manufacture silicon wafers will not be able to meet the ever-increasing demand cost-effectively. This paper reports an experimental investigation into a grinding-based manufacturing method, which has potential to manufacture flat silicon wafers at a lower cost.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers X.H. Zhanga, Z.J.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method has been investigated experimentally to demonstrate its potential to manufacture flat silicon wafers at a lower cost. It has been demonstrated that the site flatness on the ground wafers (except for a few sites at the wafer center) could meet the stringent specifications for future silicon wafers.

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a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

A grinding-based manufacturing method for silicon wafers has been investigated. It has been demonstrated that the site flatness on the ground wafers (except for a few sites at the wafer center) could meet the stringent specifications for future silicon wafers.

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a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

grinding-based manufacturing method for silicon wafers has been investigated. It has been demon-strated that the site flatness on the ground wafers (except for a few sites at the wafer center) could meet the stringent specifications for future silicon wafers.

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a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

A key process for the grinding-based manufacturing method for silicon wafers is wafer grinding (shown in Figure 2). For wafer grinding, the 65 rotation axis for the grinding wheel is offset by a distance of the wheel radius relative to the rotation axis of the wafer.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

grinding-based manufacturing method for silicon wafers. There are five sections in this paper.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers has been investigated and the results were published in three papers. The first paper [4] demonstrated that the site flatness on the ground ...

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a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

It is difficult for the lapping-based manufacturing method currently used to manufacture the majority of silicon wafers to meet the ever-increasing demand for flatter wafers at lower costs. A grinding-based manufacturing method for silicon wafers has been investigated.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

Silicon wafers are the fundamental building blocks for most integrated circuits. The lapping-based manufacturing method currently used to manufacture the majority of silicon wafers will not be able to meet the ever-increasing demand for flatter wafers and lower prices.

Get Price
a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

grinding-based manufacturing method for silicon wafers has been investigated. It has been It has been demonstrated that the site flatne ss on the ground wafers (except for a few sites at the wafer ...

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers: Generation mechanisms of central dimples on ground wafers March 2006 International Journal of Machine Tools and Manufacture 46(3):397-403

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers: Generation mechanisms of central bumps on ground wafers April 2006 Machining Science and Technology 10(2):219-233

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

The majority of semiconductors are built on silicon wafers. Future semiconductors will require flatter wafers with a lower price.

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grinding process wafers - anlaufstelle-lf.ch

grinding process wafers - anlaufstelle-lf.ch

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS . This paper reports another study on the grinding-based method aiming to reduce the cost of chemical-mechanical polishingthe final material removal process in manufacturing of silicon wafers.

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[pdf] grinding of silicon wafers: a review from historical ...

[PDF] Grinding of silicon wafers: A review from historical ...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high-quality silicon wafers involves several machining processes including grinding.

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elid grinding of silicon wafers: a literature review ...

ELID grinding of silicon wafers: A literature review ...

Single crystal silicon is used to manufacture more than 90% of the semiconductor devices .About 150 million silicon wafers of different sizes are manufactured each year worldwide .As shown in Fig. 1, the major manufacturing processes for silicon wafers include crystal growth, slicing, flattening (grinding or lapping), etching, and polishing .More information on these processes can be found ...

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recent developments in grinding of advanced materials ...

Recent developments in grinding of advanced materials ...

Sun W, Pei ZJ, Fisher G (2006) A grinding-based manufacturing method for silicon wafers: Generation mechanisms of central bumps on ground wafers. Mach Sci Technol 10(2):219–233.

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a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

The traditional lapping-based manufacturing method is unable to satisfy the ever-increasing demand for better flatness and lower cost. Previous experimental study of a grinding-based manufacturing method has shown that excellent site flatness can be obtained on ground wafers except for a few sites at the wafer center.

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a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

Silicon wafers are the fundamental building blocks for most integrated circuits. The lapping-based manufacturing method currently used to manufacture the majority of silicon wafers will not be able to meet the ever-increasing demand for flatter wafers and lower prices.

Get Price
a grinding-based manufacturing method for silicon wafers ...

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS ...

It is difficult for the lapping-based manufacturing method currently used to manufacture the majority of silicon wafers to meet the ever-increasing demand for flatter wafers at lower costs. A grinding-based manufacturing method for silicon wafers has been investigated.

Get Price
a grinding-based manufacturing method for silicon wafers ...

A grinding-based manufacturing method for silicon wafers ...

The majority of semiconductors are built on silicon wafers. Future semiconductors will require flatter wafers with a lower price.

Get Price
grinding process wafers - anlaufstelle-lf.ch

grinding process wafers - anlaufstelle-lf.ch

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS . This paper reports another study on the grinding-based method aiming to reduce the cost of chemical-mechanical polishingthe final material removal process in manufacturing of silicon wafers.

Get Price
[pdf] grinding of silicon wafers: a review from historical ...

[PDF] Grinding of silicon wafers: A review from historical ...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high-quality silicon wafers involves several machining processes including grinding.

Get Price
us20090061740a1 - method for manufacturing silicone wafers ...

US20090061740A1 - Method for manufacturing silicone wafers ...

A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer.

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method for manufacturing silicone wafers - menzel, andreas

METHOD FOR MANUFACTURING SILICONE WAFERS - Menzel, Andreas

METHOD FOR MANUFACTURING SILICONE WAFERS . United States Patent Application 20090060821 .

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recent developments in grinding of advanced materials ...

Recent developments in grinding of advanced materials ...

Sun W, Pei ZJ, Fisher G (2006) A grinding-based manufacturing method for silicon wafers: Generation mechanisms of central bumps on ground wafers. Mach Sci Technol 10(2):219–233.

Get Price
method for manufacturing silicon wafers - sumco corporation

Method for Manufacturing Silicon Wafers - SUMCO CORPORATION

Method for Manufacturing Silicon Wafers . United States Patent Application 20070224821 .

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